Sitaraman, Suresh. K.: шукати на сайті Z-Library

Soldering & Surface Mount Technology

Рік:

2015

Мова:

english

Файл:

PDF, 2.35 MB

english, 2015

The size effect on intermetallic microstructure evolution of critical solder joints for flip chip assemblies

Tian, Ye, Chow, Justin, Liu, Xi, Sitaraman, Suresh K.

Журнал:

Рік:

2015

Мова:

english

Файл:

PDF, 392 KB

english, 2015

Study of Chip–Package Interaction Parameters on Interlayer Dielectric Crack Propagation

Raghavan, Sathyanarayanan, Schmadlak, Ilko, Leal, George, Sitaraman, Suresh K.

Журнал:

IEEE Transactions on Device and Materials Reliability

Рік:

2014

Мова:

english

Файл:

PDF, 1.61 MB

english, 2014

Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications

Ahmad, Mudasir, Sitaraman, Suresh K.

Журнал:

Kwatra, Abhishek, Samet, David, Rambhatla, V.N.N. Trilochan, Sitaraman, Suresh K.

Рік:

2002

Мова:

english

Файл:

PDF, 498 KB

english, 2002

Effect of temperature and humidity conditioning on copper leadframe/mold compound interfacial delamination

Журнал:

Lin, Ziyin, Liu, Yan, Raghavan, Sathyanarayanan, Moon, Kyoung-sik, Sitaraman, Suresh K., Wong, Ching-ping

Рік:

2020

Файл:

PDF, 1.59 MB

2020

Magnetic Alignment of Hexagonal Boron Nitride Platelets in Polymer Matrix: Toward High Performance Anisotropic Polymer Composites for Electronic Encapsulation

Журнал:

ACS Applied Materials & Interfaces

Рік:

2013

Мова:

english

Файл:

PDF, 1.62 MB

english, 2013

Reliability Assessment of Through-Silicon Vias in Multi-Die Stack Packages

Liu, Xi, Chen, Qiao, Sundaram, Venkatesh, Simmons-Matthews, Margaret, Wachtler, Kurt P., Tummala, Rao R., Sitaraman, Suresh K.

Журнал:

IEEE Transactions on Device and Materials Reliability

Рік:

2012

Мова:

english

Файл:

PDF, 1.21 MB

english, 2012

Reliability Modeling and Assessment of Embedded Capacitors in Organic Substrates

Lee, Kang J., Damani, Manoj, Pucha, Raghuram V., Bhattacharya, Swapan K., Tummala, Rao R., Sitaraman, Suresh K.

Журнал:

IEEE Transactions on Components and Packaging Technologies

Рік:

2007

Мова:

english

Файл:

PDF, 1.76 MB

english, 2007

Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment

Pucha, Raghuram V., Tunga, Krishna, Pyland, James, Sitaraman, Suresh K.

Журнал:

Xie, Weidong, Sitaraman, Suresh K.

Рік:

2004

Мова:

english

Файл:

PDF, 747 KB

english, 2004

Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures

Журнал:

Zhang, Xuchen, Nasr, Mohamed H., Woodrum, David C., Green, Craig E., Kottke, Peter A., Sarvey, Thomas E., Joshi, Yogendra K., Sitaraman, Suresh K., Fedorov, Andrei G., Bakir, Muhannad S.

Рік:

2000

Мова:

english

Файл:

PDF, 119 KB

english, 2000

[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Design, microfabrication and thermal characterization of a hotspot cooler testbed for convective boiling experiments in extreme-microgap with integrated micropin-fins

Рік:

2016

Мова:

english

Файл:

PDF, 795 KB

english, 2016

Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling

Variyam, Manjula N., Xie, Weidong, Sitaraman, Suresh K.

Журнал:

Modi, Mitul, Sitaraman, Suresh K.

Рік:

2000

Мова:

english

Файл:

PDF, 645 KB

english, 2000

Interfacial Fracture Toughness Measurement of a Ti/Si Interface

Журнал:

Zhu, Qi, Ma, Lunyu, Sitaraman, Suresh K.

Рік:

2004

Мова:

english

Файл:

PDF, 1008 KB

english, 2004

Development of G-Helix Structure as Off-Chip Interconnect

Журнал:

Tunga, Krishna, Sitaraman, Suresh K.

Рік:

2004

Мова:

english

Файл:

PDF, 527 KB

english, 2004

An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls

Журнал:

Journal of Applied Polymer Science

Рік:

2007

Мова:

english

Файл:

PDF, 502 KB

english, 2007

Investigation of the curing behavior of a novel epoxy photo-dielectric dry film (ViaLux™ 81) for high density interconnect applications

Rajiv C. Dunne, Suresh K. Sitaraman, Shijian Luo, Yang Rao, C. P. Wong, William E. Estes, Ceferino G. Gonzalez, John C. Coburn, Mookan Periyasamy

Журнал:

Рік:

2000

Мова:

english

Файл:

PDF, 248 KB

english, 2000

An experimental technique to determine critical stress intensity factors for delamination initiation

Weidong Xie, Suresh K Sitaraman

Журнал:

Mitul B. Modi, Suresh K. Sitaraman

Рік:

2003

Мова:

english

Файл:

PDF, 237 KB

english, 2003

Interfacial fracture toughness measurement for thin film interfaces

Журнал:

Andy Perkins, Suresh K. Sitaraman

Рік:

2004

Мова:

english

Файл:

PDF, 437 KB

english, 2004

Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages

Журнал:

Krishna Tunga, Suresh K. Sitaraman

Рік:

2007

Мова:

english

Файл:

PDF, 486 KB

english, 2007

Laser moiré interferometry for fatigue life prediction of lead-free solders

Журнал:

Shashikant Hegde, Raghuram V. Pucha, Suresh K. Sitaraman

Рік:

2010

Мова:

english

Файл:

PDF, 1.88 MB

english, 2010

Enhanced reliability of high-density wiring (HDW) substrates through new base substrate and dielectric materials

Журнал:

Journal of Materials Science: Materials in Electronics

Рік:

2004

Мова:

english

Файл:

PDF, 544 KB

english, 2004

[IEEE 2012 IEEE 12th International Conference on Nanotechnology (IEEE-NANO) - Birmingham, United Kingdom (2012.08.20-2012.08.23)] 2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO) - The fabrication of ultra long metal nanowire bumps and their application as interconnects

Xu, Ju, Razeeb, Kafil M., Sitaraman, Suresh K., Mathewson, Alan

Рік:

2012

Мова:

english

Файл:

PDF, 1.72 MB

english, 2012

Compliance analysis of multi-path fan-shaped interconnects

Chen, Wei, Okereke, Raphael, Sitaraman, Suresh K.

Журнал:

Рік:

2013

Мова:

english

Файл:

PDF, 2.48 MB

english, 2013

Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies

Tian, Ye, Liu, Xi, Chow, Justin, Wu, Yi Ping, Sitaraman, Suresh K.

Журнал:

Рік:

2014

Мова:

english

Файл:

PDF, 1.17 MB

english, 2014

Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test

Liu, Xi, Chen, Qiao, Sundaram, Venkatesh, Tummala, Rao R., Sitaraman, Suresh K.

Журнал:

Kacker, Karan, Sitaraman, Suresh K.

Рік:

2013

Мова:

english

Файл:

PDF, 1.67 MB

english, 2013

Design and Fabrication of FlexConnects: A Cost-Effective Implementation of Compliant Chip-to-Substrate Interconnects

Журнал:

IEEE Transactions on Components and Packaging Technologies

Рік:

2008

Мова:

english

Файл:

PDF, 1.19 MB

english, 2008

Experimental and Simulation Study of Double-Sided Flip-Chip Assembly With a Stiffener Ring

Liu, Xi, Li, Ming, Mullen, Donald R., Cline, Julia, Sitaraman, Suresh K.

Журнал:

IEEE Transactions on Device and Materials Reliability

Рік:

2014

Мова:

english

Файл:

PDF, 2.74 MB

english, 2014

Silicon and Nanoscale Metal Interface Characterization Using Stress-Engineered Superlayer Test Methods

Zheng, Jiantao, Modi, Mitul, Ginga, Nicholas, Sitaraman, Suresh

Журнал:

IEEE Transactions on Components and Packaging Technologies

Рік:

2009

Мова:

english

Файл:

PDF, 1.40 MB

english, 2009

Response Surface and Multiobjective Optimization Methodology for the Design of Compliant Interconnects

Wei Chen,, Sitaraman, Suresh K.

Журнал:

IEEE Transactions on Components Packaging and Manufacturing Technology

Рік:

2014

Мова:

english

Файл:

PDF, 2.34 MB

english, 2014

In-situ microscale through-silicon via strain measurements by synchrotron x-ray microdiffraction exploring the physics behind data interpretation

Liu, Xi, Thadesar, Paragkumar A., Taylor, Christine L., Oh, Hanju, Kunz, Martin, Tamura, Nobumichi, Bakir, Muhannad S., Sitaraman, Suresh K.

Журнал:

Applied Physics Letters

Рік:

2014

Мова:

english

Файл:

PDF, 4.36 MB

english, 2014

Domed and Released Thin-Film Construct—An Approach for Material Characterization and Compliant Interconnects

Ostrowicki, Gregory T., Fritz, Nathan T., Okereke, Raphael I., Kohl, Paul A., Sitaraman, Suresh K.

Журнал:

IEEE Transactions on Device and Materials Reliability

Рік:

2012

Мова:

english

Файл:

PDF, 723 KB

english, 2012

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Design and assembly of a double-sided 3D package with a controller and a DRAM stack

Liu, Xi, Li, Ming, Mullen, Don, Cline, Julia, Sitaraman, Suresh K.

Рік:

2012

Мова:

english

Файл:

PDF, 1.26 MB

english, 2012

Fabrication and Bioconjugation of Micro- and Nanoscale Structures Intended for Cancer-Specific Antigen Detection

Klein, Kevin M., Ostrowicki, Gregory, Gewirtz, Andrew T., Sitaraman, Suresh K.

Журнал:

Liu, Xi, Zheng, Jiantao, Sitaraman, Suresh K.

Рік:

2009

Мова:

english

Файл:

PDF, 463 KB

english, 2009

Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly

Журнал:

Chen, Wei, Bhat, Anirudh, Sitaraman, Suresh K.

Рік:

2010

Мова:

english

Файл:

PDF, 1.42 MB

english, 2010

Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages

Журнал:

McCann, Scott, Sato, Yoichiro, Sundaram, Venkatesh, Tummala, Rao R., Sitaraman, Suresh K.

Рік:

2015

Мова:

english

Файл:

PDF, 4.28 MB

english, 2015

Prevention of Cracking From RDL Stress and Dicing Defects in Glass Substrates

Журнал:

IEEE Transactions on Device and Materials Reliability

Рік:

2016

Мова:

english

Файл:

PDF, 1.78 MB

english, 2016

Double-Side Process and Reliability of Through-Silicon Vias for Passive Interposer Applications

Chen, Qiao, Liu, Xi, Sundaram, Venkatesh, Sitaraman, Suresh K., Tummala, Rao R.

Журнал:

IEEE Transactions on Device and Materials Reliability

Рік:

2014

Мова:

english

Файл:

PDF, 2.00 MB

english, 2014

Cyclic magnetic actuation technique for thin film interfacial fatigue crack propagation

Ostrowicki, Gregory T., Sitaraman, Suresh K.

Журнал:

McCann, Scott, Kuramochi, Satoru, Yun, Hobie, Sundaram, Venkatesh, Pulugurtha, M. Raj, Tummala, Rao R., Sitaraman, Suresh K.

Рік:

2016

Мова:

english

Файл:

PDF, 1.41 MB

english, 2016

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Board-Level Reliability of 3D through Glass via Filters During Thermal Cycling

Рік:

2016

Мова:

english

Файл:

PDF, 509 KB

english, 2016

Process Innovations to Prevent Glass Substrate Fracture From RDL Stress and Singulation Defects

McCann, Scott, Singh, Bhupender, Smet, Vanessa, Sundaram, Venkatesh, Tummala, Rao R., Sitaraman, Suresh K.

Журнал:

IEEE Transactions on Device and Materials Reliability

Рік:

2016

Мова:

english

Файл:

PDF, 1.82 MB

english, 2016

[ASME ASME 2011 International Mechanical Engineering Congress and Exposition - Denver, Colorado, USA (November 11–17, 2011)] Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration - Reliable Design of TSV in Free-Standing Wafers and 3D Integrated Packages

Liu, Xi, Simmons-Matthews, Margaret, Wachtler, Kurt P., Sitaraman, Suresh K.

Рік:

2011

Мова:

english

Файл:

PDF, 2.19 MB

english, 2011

Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array Package

Perkins, Andy, Sitaraman, Suresh K.

Журнал:

Krieger, William E. R., Raghavan, Sathyanarayanan, Sitaraman, Suresh K.

Рік:

2008

Мова:

english

Файл:

PDF, 1.66 MB

english, 2008

Experiments for Obtaining Cohesive-Zone Parameters for Copper-Mold Compound Interfacial Delamination

Журнал:

IEEE Transactions on Components Packaging and Manufacturing Technology

Рік:

2016

Мова:

english

Файл:

PDF, 1.92 MB

english, 2016

[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Micro and Nano Thin Film Devices as Bio-Assays for Cancer Diagnosis

Klein, Kevin M., Ostrowicki, Gregory T., Gerwitz, Andrew, Sitaraman, Suresh K.

Рік:

2006

Мова:

english

Файл:

PDF, 1.36 MB

english, 2006

Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials

Mahalingam, Saketh, Prabhakumar, Ananth, Tonapi, Sandeep, Sitaraman, Suresh K.

Журнал:

Raghavan, Sathyanarayanan, Sitaraman, Suresh K.

Рік:

2008

Мова:

english

Файл:

PDF, 496 KB

english, 2008

Shear test on hard coated flip-chip bumps to measure back end of the line stack reliability

Журнал:

Okereke, Raphael, Kacker, Karan, Sitaraman, Suresh K.

Рік:

2017

Мова:

english

Файл:

PDF, 2.91 MB

english, 2017

Investigation of Dual Electrical Paths for Off-Chip Compliant Interconnects

Журнал:

McCann, Scott, Ostrowicki, Gregory T., Tran, Anh, Huang, Timothy, Bernhard, Tobias, Tummala, Rao R., Sitaraman, Suresh K.

Рік:

2013

Мова:

english

Файл:

PDF, 2.18 MB

english, 2013

Determination of Energy Release Rate Through Sequential Crack Extension

Журнал:

Bhattacharya, Swapan, Varadarajan, Mahesh, Chahal, Premjeet, Lee, K. J., Bhattacharjee, Ajanta, Tummala, Rao R., Sitaraman, Suresh, Papapolymerou, John, Tentzeris, Manos, Laskar, Joy

Рік:

2017

Мова:

english

Файл:

PDF, 1.62 MB

english, 2017

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - SOP Embedded Thin Film Resistors on High and Low Loss Thin Film Dielectrics

Рік:

2005

Мова:

english

Файл:

PDF, 465 KB

english, 2005

Random vibration analysis of 3-Arc-Fan compliant interconnects

Chung, Philip Y., Sitaraman, Suresh K.

Журнал: